Shanghai wukong Technology Co.,Ltd

Showing 1 - 9 of 9, total 1 pages [First] [Previous] [Next] [Last]

cob board
Specification: COB PCB
Detail: COB, Bonding PCB

fpc
Specification: FPC
Detail: FPC

high tg
Specification: High Tg
Detail: TG>180

aluminium base pcb
Specification: Aluminium base PCB
Detail: Insulation thickness: 200 um Thermal Conductivity£º6.5 W/mK Solder resistance: pass 300¡æ¡Á 2min the base material£ºAL base

multilayer pcb
Specification: Multilayer PCB
Detail: layer:16 Hole copper£º¡Ý20um(0.8mil) Surface copper£º30-50um(1.2-2mil) Aspect ratio:12:1 Min hole£º0.3mm(12mil)

sterling silver pcb
Specification: Sterling silver PCB
Detail: Layer£º8 Hole copper£º¡Ý25um1(0 mil) Surface copper£º35-55um (1.37-2.2mil) Thickness£º1.6¡À0.152mm(62¡À5.9mil) Surface Treatment£ºImmersion Ag

heavy copper (¡Ý2oz))
Specification: Heavy copper (¡Ý2OZ))
Detail: layer:6 Hole copper£º¡Ý25um (1mil) Surface copper£º¡Ý56um (2.2mil) Thickness£º2.0¡À0.2mm(78.7¡À0.787mil)

rigid-flex board
Specification: Rigid-flex board
Detail: Layer Count £º6 Thickness £º63.0mil (1.6mm) Base Material £ºISOLA IS410 Surface Finish £ºENIG Application £ºPower Electronics

hdi pcb
Specification: HDI PCB
Detail: Blind hole copper: Via filling Width/Length£º0.076/0.076mm(3/3mil) Thickness£º0.68¡À0.08mm(26.8¡À3.1mil) Remark: 3 step HDI


Showing 1 - 9 of 9, total 1 pages [First] [Previous] [Next] [Last]
1